Order SnoAT All Teflon Cartridge Filters from MS factory when your high purity process requires a filter cartridge that provides exceptional chemical resistance, ultra low extractables, and consistent particle retention in aggressive chemical environments. The SnoAT series is constructed with superior pleated PTFE (polytetrafluoroethylene) membrane with PFA support for chemical inertness across a broad range of microelectronics process chemical applications. The filter is made without the use of additives, surface modification agents, or post treatments to ensure purity performance is not compromised, and it is manufactured in a clean room environment to minimize particulate and ionic contamination.
The all fluoropolymer construction of the SnoAT series provides exceptional chemical resistance across acids, bases, solvents, and photoresist formulations used in semiconductor and microelectronics manufacturing. The hydrophobic PTFE membrane provides consistent particle retention with uniform pore size distribution, and the optimized 80 to 95 percent porosity supports low pressure drop, high flow rate, and long service life. Each filter is pre flushed with ultrapure DI water (18.2 megaohm centimeter, TOC less than 10 ppb) to reduce rinse up time and support faster qualification in high purity process systems. With purity specifications including particle shedding less than 5 particles per milliliter at 0.15 micron, TOC recovery less than 5 ppb, and metallic cleanliness less than 25 micrograms per device, the SnoAT series delivers the ultra high purity performance that critical microelectronics applications demand.
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Parameter |
Value |
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Pore Size |
0.05, 0.1, 0.2, 0.45, 1, 5, 10 micron |
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Maximum Differential Pressure |
5.0 bard (72.5 psid) at 25 degree C (68 degree F) |
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Recommended Change out Differential Pressure |
2.4 bard (34.8 psid) |
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Porosity |
80 percent to 95 percent |
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Parameter |
Specification |
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Particle Shedding |
Less than 5 particles per 1 ml at 0.15 micron and above at 10 LPM UPW flow |
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TOC Recovery (per 10 inch equivalent) |
Less than 5 ppb of feed DI water after 120 L at 5 LPM |
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Resistivity Recovery (per 10 inch equivalent) |
Less than 0.5 megaohm of feed DI water after 120 L at 5 LPM |
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Metallic Cleanliness |
Less than 25 microgram per device |
• Filter media: Hydrophobic PTFE membrane
• Support: PFA end caps, core, cage
• Gaskets and O rings: PFA Encapsulated FKM
• Superior chemical inertness. All fluoropolymer construction with PTFE membrane and PFA hardware provides exceptional chemical resistance across acids, bases, solvents, and photoresist formulations used in microelectronics manufacturing.
• No additives or surface treatments. Manufactured without additives, surface modification agents, or post treatments to ensure purity performance is not compromised and no filter derived contaminants are introduced.
• Clean room manufacturing. High purity application filters manufactured in a clean room environment to minimize particulate and ionic contamination during production.
• Fast rinse up time. Each filter pre flushed with ultrapure DI water (18.2 megaohm centimeter, TOC less than 10 ppb) to reduce rinse up time and support faster qualification.
• Optimized porosity and flow. 80 to 95 percent porosity with uniform pore size distribution supports low pressure drop, high flow rate, and long service life.
• Photoresist and developer filtration. Provides consistent particle retention with ultra low extractables, ensuring photoresist and developer solutions meet purity requirements for high resolution patterning. All fluoropolymer construction provides compatibility with organic solvents and aqueous base solutions.
• Wet etching chemical filtration. Exceptional chemical resistance to aggressive etchants while maintaining ultra low extractables and consistent particle retention. PTFE membrane and PFA hardware ensure the filter does not degrade or contribute contaminants in aggressive etching chemistries.
• Cleaning solution filtration. Provides chemical resistance and ultra low extractables for critical cleaning steps including SC1, SC2, and dilute hydrofluoric acid, helping ensure cleaning solutions do not introduce contamination.
• Ultrapure water distribution. Point of use filtration provides a final barrier against particulates that may accumulate in distribution piping, with fast rinse up time supporting quick system qualification and minimal water waste.
• Process gas filtration. Hydrophobic PTFE membrane is also suitable for process gas filtration, providing consistent particle removal with low pressure drop and no liquid wetting concerns, making SnoAT All Teflon Cartridge Filters suitable for both liquid and gas filtration in semiconductor manufacturing.
• Before installation. Inspect filter for shipping damage, verify gasket material and connection style match system requirements. Handle by end caps only to avoid contaminating membrane or hardware.
• Installation. Install with correct flow orientation, tighten housing closure to recommended torque. Flush with ultrapure water or process chemical until effluent purity meets acceptance criteria for TOC, resistivity, and particulates.
• Qualification. Factory pre flushing reduces rinse up time, but site specific flushing is still necessary to achieve ultra low TOC and ionic contamination levels. We can provide guidance on recommended flush volumes and flow rates.
• Changeout. Monitor differential pressure and replace when reaching recommended change out value of 2.4 bard to ensure optimal performance and prevent media damage.
Because microelectronics customers require verifiable purity, MS factory supplies each SnoAT batch with purity test reports covering TOC, resistivity recovery, metallic cleanliness, and particle shedding, plus integrity test results, dimensional inspection records, clean room manufacturing certificates, rinse up data, and full batch traceability documentation. Each production batch carries a unique identifier linking raw material lots, production parameters, inspection results, and purity test data. For qualification oriented procurement in semiconductor and microelectronics facilities, additional documentation packages are available to support customer validation files and regulatory compliance requirements.
Microelectronics and semiconductor customers rely on MS factory for SnoAT programs because our clean room manufacturing environment and in house PTFE membrane production enable consistent purity performance batch after batch, with dependable delivery for standard configurations. We partner with customers to define safety stock levels and recurring delivery schedules that align with semiconductor production planning and maintenance cycles. Our technical group provides support for filter selection, pore size determination, system sizing, rinse up protocol development, and changeout scheduling based on specific process chemicals and operating conditions. OEM options for semiconductor equipment manufacturers include custom dimensions, connection styles, and private label branding. For high purity microelectronics and semiconductor processing applications that demand exceptional chemical inertness and ultra low extractables, the performance and reliability of SnoAT All Teflon Cartridge Filters meet the requirements of these critical applications.
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SPAT |
Pore size |
Vent |
Length |
Seal |
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0x5=0.05µm 001=0.1µm 002=0.2µm 005=0.45µm 010=1.0µm 050=5.0µm 100=10µm
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0=222/flat
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10=10" 20=20" 30=30"
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T=Teflon encapsulated vition
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